ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material

Product Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material

Contact Now

ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material

Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini...

Product Tags:

Half Hole BGA Substrate

ENEPIG BGA Substrate

BT FR4 Package Substrate

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	HongRuiXing (Hubei) Electronics Co.,Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!