Multilayer BT materials semiconductor package substrate manufacture

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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Multilayer BT materials semiconductor package substrate manufacture

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Multilayer BT materials semiconductor package substrate manufacture

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS...

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4 Layer fr4 circuit board

0.3mm Rigid Circuit Boards

VCP Gold Plated Rigid Circuit Boards

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