MGC brand BT CSP package Substrate Fabrication

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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MGC brand BT CSP package Substrate Fabrication

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MGC brand BT CSP package Substrate Fabrication

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1...

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BT FR4 CSP substrate

4 Layer CSP substrate

MSAP CSP substrate

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